Advantages and Disadvantages of Ion Beam Sputtering
Ion beam sputtering is a thin film process technology that uses an ion source to sputter a target onto a substrate. Compared to other PVD technologies, ion beam sputtering is more accurate and can accurately control the thickness of the substrate.
Application of sputtering targets in vacuum coating
Almost all of the new type of sputtering equipment uses a powerful magnet to spiral the electrons to accelerate the ionization of argon around the target, resulting in an increased probability of collision between the target and the argon ions, increasing the sputtering rate. Generally speaking, most metal coatings use DC sputtering, while non-conductive ceramic materials use RF sputtering. The basic principle of sputtering is: argon (Ar) ions are struck against the target surface by a glow…
An Overview of Electron Beam Evaporation | Physical Vapor Deposition
Electron beam evaporation is a type of PVD (physical vapor deposition) techniques, which directly heats the evaporation material (usually pellets) by using an electron beam under vacuum, and transports the vaporized material to the substrate to form a film.